System, method and apparatus for applying liquid to a CMP...

Abrading – Abrading process – Abradant supplying

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C451S056000

Reexamination Certificate

active

06872128

ABSTRACT:
A system and method of delivering a liquid to a CMP polishing pad includes supplying the liquid to a nozzle, the nozzle being oriented toward a polishing surface of the CMP polishing pad. The liquid flows at a rate of less than or equal to about 100 cc per minute. A pressurized carrier gas is also supplied to the nozzle. The liquid is substantially evenly sprayed from the nozzle onto the CMP polishing pad.

REFERENCES:
patent: 5679063 (1997-10-01), Kimura et al.
patent: 5716264 (1998-02-01), Kimura et al.
patent: 5997392 (1999-12-01), Chamberlin et al.
patent: 6149508 (2000-11-01), Vanell et al.
patent: 6338669 (2002-01-01), Togawa et al.
patent: 6506098 (2003-01-01), Ho et al.
patent: 6669538 (2003-12-01), Li et al.
patent: 6702651 (2004-03-01), Tolles
patent: 20020022440 (2002-02-01), Kunugi
patent: 20020023715 (2002-02-01), Kimura et al.
patent: 20030027505 (2003-02-01), Withers et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System, method and apparatus for applying liquid to a CMP... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System, method and apparatus for applying liquid to a CMP..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System, method and apparatus for applying liquid to a CMP... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3374411

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.