System memory board subsystem using DRAM with stacked...

Electrical computers and digital processing systems: memory – Storage accessing and control – Specific memory composition

Reexamination Certificate

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Details

C711S102000

Reexamination Certificate

active

07409491

ABSTRACT:
A memory system comprising memory modules including memory chips stacked with switching circuits. A memory controller coupled to the memory modules is configured to initiate memory accesses. When a stacked switching circuit detects the memory access, the switching circuit routes the access to another memory module if the access is not directed to a memory chip of the receiving memory module, or processes the access locally if the access is directed to a memory chip of the receiving memory module. The memory controller and memory modules are coupled via bi-directional serial links. Each memory module may include multiple stacked switching circuits, each of which may be coupled to fewer than all of the memory chips within the memory module. Switching circuits further include circuitry configured to de-serialize data prior to conveyance to a memory chip, and serialize data received from a DRAM chip prior to transmitting the received data. Switching circuits may be coupled to a stacked memory chip via a flexible interconnect, and may also be manufactured side by side with a corresponding memory chip on a flexible circuit board.

REFERENCES:
patent: 6295586 (2001-09-01), Novak et al.
patent: 6502161 (2002-12-01), Perego et al.
patent: 6571325 (2003-05-01), Satagopan et al.
patent: 6725314 (2004-04-01), Dong
patent: 6882082 (2005-04-01), Greeff et al.
patent: 6889304 (2005-05-01), Perego et al.
patent: 6922770 (2005-07-01), Shanmugasundaram et al.
patent: 6941428 (2005-09-01), Carr
patent: 7017022 (2006-03-01), Jeddeloh
patent: 7032092 (2006-04-01), Lai
patent: 7051151 (2006-05-01), Perego
patent: 7257129 (2007-08-01), Lee et al.
patent: 2004/0030794 (2004-02-01), Hugly et al.
patent: 2004/0183795 (2004-09-01), Deering et al.
patent: 2005/0166026 (2005-07-01), Ware et al.
patent: 2005/0198458 (2005-09-01), Cho
patent: 2006/0020740 (2006-01-01), Bartley et al.
patent: 2006/0024541 (2006-02-01), Weiss et al.
patent: 2 416 056 (2006-01-01), None
patent: WO 2004/109528 (2004-12-01), None
patent: WO 2005/066965 (2005-07-01), None
U.S. Appl. No. 11/124,848, filed May 9, 2005.
U.S. Appl. No. 11/304,166, filed Dec. 15, 2005.
U.S. Appl. No. 11/260,416, filed Oct. 27, 2005.
U.S. Appl. No. 11/205,706, filed Aug. 17, 2005.
U.S. Appl. No. 11/249,099, filed Oct. 12, 2005.
U.S. Appl. No. 10/975,650, filed Oct. 28, 2004.
U.S. Appl. No. 10/989,577, filed Nov. 16, 2004.
Fully Buffered DIMM (FB-DIMM) Server Memory Architecture: Capacity, Performance, Reliability and Longevity- Feb. 18, 2004- Retrieved from http://www.idt.com/content/OSA—FB-DIMM-arch.pdf VOGT-Note connections of FB-DIMM's on p. 9.

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