System including integrated circuit structures formed in a...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S750000, C257S751000

Reexamination Certificate

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07544986

ABSTRACT:
A method of forming integrated circuit structures, such as capacitors and conductive plugs, within contact openings formed in a photosensitive silicone ladder polymer (PVSQ) is disclosed. Contact openings with reduced striations and CD loss are formed in a photosensitive silicone ladder polymer (PVSQ) layer by patterning the PVSQ film employing a photomask with a predefined pattern, exposing the PVSQ film to i-line, developing the exposed PVSQ film in a mixture of anisole/xylene in a ratio of about 1:2 for about 30 seconds, and subsequently optionally annealing the undeveloped PVSQ film at a temperature of about 300° C. to about 600° C.

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English translation of JP 2000-136223 (May 2000).
Yasuda et al., “Photocrosslinking Reactoin of Vinyl-Functional Polyphenylsilsesquioxane Sensitized with Aromatic Bisazide Compounds”, Journal of Polymer Science: Part A: Polymer Chemistry, vol. 39, 4196-4205, (2001).

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