System-in-package type semiconductor device

Details System-in-package type semiconductor device System-in-package type semiconductor device

2005-08-02

2005-08-02

Le, Vu A. (Department: 2824)

Static information storage and retrieval

Read/write circuit

Testing

C365S063000

Reexamination Certificate

active

06925018

ABSTRACT:
A system-in-package (SiP) type semiconductor device has a test function capable of conducting a test singly on a memory chip directly from outside. When a mode signal included in a test signal input from an external connection terminal indicates a “normal operation mode”, a test circuit provided on a logic chip allows a logic circuit to use an access path (wiring) to a memory circuit. On the other hand, when the mode signal indicates a “test mode”, the test circuit uses the access path to access the memory circuit and conducts a test, an accelerated life test, or a multi-bit test, based on the content of the test signal input from the external connection terminal. The test circuit also conducts a built-in self-test.

REFERENCES:
patent: 6732304 (2004-05-01), Ong
patent: 2003/0037277 (2003-02-01), Tamura
patent: 2003/0065997 (2003-04-01), Yamazaki et al.
patent: 58-166275 (1983-10-01), None
patent: 61-54550 (1986-03-01), None
patent: 4-85848 (1992-03-01), None
patent: 10-283777 (1998-10-01), None
patent: 11-211794 (1999-08-01), None
patent: 11-250700 (1999-09-01), None
patent: 2000-332192 (2000-11-01), None
patent: 2001-35200 (2001-02-01), None

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