System having semiconductor die mounted in die-receiving area ha

Details System having semiconductor die mounted in die-receiving area ha System having semiconductor die mounted in die-receiving area ha

1996-04-02

1998-05-19

Ngo, Ngan V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257666, 257783, 257784, 257776, H01L 23495, H01L 2348, H01L 2352

Patent

active

057539707

ABSTRACT:
Electronic systems utilizing a plurality of integrated circuit packages having at least some large gaps between edges of a semiconductor die and the inner ends of package conductors defining a die-receiving area, one or more bond wire support structure are disposed in the gap, thereby causing a long bond wire to behave as two or more shorter bond wires. The bond wires are tacked to a top surface of the support structure by various alternative means. Alternatively, a "jumper" structure having conductive traces of graduated length can be disposed in the die-receiving area between the die and the edges of the die-receiving area, providing an intermediate connection between the die and the leads of the package, thereby permitting short bond wires to be used in lieu of long bond wires.

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