System for treating a surface of a rotating wafer

Details System for treating a surface of a rotating wafer System for treating a surface of a rotating wafer

1989-08-11

1991-07-16

Fisher, Richard V.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

134153, 134902, 134 254, 156626, 156345, H01L 21306

Patent

active

050322176

ABSTRACT:
An apparatus and method for treating a surface of a wafer by using a treatment solution includes a wafer rotating device for rotating the wafer in a horizontal plane, and a treatment solution discharge nozzle for continuously discharging the treatment solution at an angle of greater than zero and less than 45 degrees relative to the surface of the rotating wafer. The treatment solution discharged from the treatment solution discharge nozzle impinges upon the surface of the wafer at the point nearer to the edge than to the center and then forms a stable layer of solution on the entire surface of the wafer by making use of its speed and its centrifugal force. Since the layer of the treatment solution has an even thickness over the whole surface of the wafer, the surface of the wafer is treated uniformly. Furthermore, it is easy to optically detect an end of treatment.

REFERENCES:
patent: 3953265 (1976-04-01), Hood
patent: 4021278 (1977-05-01), Hood et al.
patent: 4161356 (1979-07-01), Giffin et al.
patent: 4178188 (1979-12-01), Dussault et al.
patent: 4317698 (1982-03-01), Christol et al.
patent: 4521255 (1985-06-01), Raymor et al.
patent: 4569717 (1986-02-01), Ohgami et al.
patent: 4767495 (1988-08-01), Nishioka
patent: 4788994 (1988-12-01), Shinbara
patent: 4871417 (1989-10-01), Nishizawa et al.

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