System for testing one or more groups of IC-chips while...

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor

Reexamination Certificate

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C324S765010

Reexamination Certificate

active

06924636

ABSTRACT:
An electromechanical system for testing IC-chips includes a total of N chip holding subassemblies, where N is an integer greater than one and where each chip holding subassembly has sockets for holding a group of IC-modules that include the IC-chips; a moving mechanism for automatically moving the i-th chip holding subassembly from a load position in the system to a test position in the system, and visa-versa, where i ranges from 1 to N and changes with time in a sequence; and a temperature control mechanism which contacts the IC-modules at the test position. Between the moving of the i-th chip holding subassembly and the next chip holding subassembly in the sequence, the IC-chips are burn-in tested on all N of the chip holding subassemblies. Also, while the i-th chip holding subassembly is being moved, burn-in testing of IC-chips on the remaining N-1 chip holding subassemblies continues.

REFERENCES:
patent: 6307388 (2001-10-01), Friedrich et al.
patent: 6307391 (2001-10-01), Tustaniwskyj et al.
patent: 6325662 (2001-12-01), Tustaniwskyj
patent: 6415409 (2002-07-01), Rhodes et al.
patent: 6522156 (2003-02-01), Tustaniwskyj et al.
patent: 6581486 (2003-06-01), Ditri et al.
patent: 6658736 (2003-12-01), Babcock et al.
patent: 6774661 (2004-08-01), Tustaniwskyj et al.
patent: 6809543 (2004-10-01), Tustaniwskyj et al.

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