Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1990-10-04
1994-09-20
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174267, 22818022, 257773, 257784, 257779, 361679, 361760, 361776, H01R 900
Patent
active
053494954
ABSTRACT:
A system for securing and electrically connecting a semiconductor chip to a body of passive substrate. The semiconductor chip and the substrate are both provided with bonding pads or bonding areas. The bonding pads or areas are located so that when a chip is placed next to the substrate, at least some of the bonding pads on the chip are aligned with corresponding bonding areas on the substrate. Micro-pins in the shape of straight wires, stubs or loops are used to electrically connect some of the bonding pads on the chip to corresponding areas on the substrate thereby electrically connecting them and also securely bonding the chip to the substrate. In the preferred embodiment, epoxy is used to further strengthen the physical bonding between the chip and the substrate. The wicking action of the micro-pins reduces bridging of solder across adjacent micro-pins.
REFERENCES:
patent: 3991347 (1976-11-01), Hollyday
patent: 4787853 (1988-11-01), Igarashi
patent: 4814944 (1989-03-01), Sagawa et al.
patent: 4836435 (1989-06-01), Napp et al.
patent: 4955523 (1990-09-01), Calomagno et al.
patent: 5062567 (1991-11-01), Nishihara et al.
Long Jon M.
Visel Thomas A.
Thompson Gregory D.
VLSI Technology Inc.
LandOfFree
System for securing and electrically connecting a semiconductor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System for securing and electrically connecting a semiconductor , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System for securing and electrically connecting a semiconductor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2430419