System for securing and electrically connecting a semiconductor

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

174267, 22818022, 257773, 257784, 257779, 361679, 361760, 361776, H01R 900

Patent

active

053494954

ABSTRACT:
A system for securing and electrically connecting a semiconductor chip to a body of passive substrate. The semiconductor chip and the substrate are both provided with bonding pads or bonding areas. The bonding pads or areas are located so that when a chip is placed next to the substrate, at least some of the bonding pads on the chip are aligned with corresponding bonding areas on the substrate. Micro-pins in the shape of straight wires, stubs or loops are used to electrically connect some of the bonding pads on the chip to corresponding areas on the substrate thereby electrically connecting them and also securely bonding the chip to the substrate. In the preferred embodiment, epoxy is used to further strengthen the physical bonding between the chip and the substrate. The wicking action of the micro-pins reduces bridging of solder across adjacent micro-pins.

REFERENCES:
patent: 3991347 (1976-11-01), Hollyday
patent: 4787853 (1988-11-01), Igarashi
patent: 4814944 (1989-03-01), Sagawa et al.
patent: 4836435 (1989-06-01), Napp et al.
patent: 4955523 (1990-09-01), Calomagno et al.
patent: 5062567 (1991-11-01), Nishihara et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System for securing and electrically connecting a semiconductor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System for securing and electrically connecting a semiconductor , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System for securing and electrically connecting a semiconductor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2430419

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.