Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus
Reexamination Certificate
2007-06-26
2007-06-26
Pizarro, Marcos D. (Department: 2814)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
C118S722000, C257SE21435
Reexamination Certificate
active
10894199
ABSTRACT:
The present disclosure provides a system for removing a spacer, such as associated with a processing operation using a lightly doped drain (LDD) region. In one example, the system includes means for creating a spacer, means for implanting a first relatively heavily doped region with the spacer in place, one or more chambers for removing the spacer, and means for implanting the LDD region with the spacer removed. The one or more chambers may be configured for applying a first dry removal process to remove the layer on the spacer utilizing a fluorine-contained plasma and applying a second wet etch process to remove the spacer.
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Chiu Hsien-Kuang
Wang Chih-Hao
Haynes and Boone LLP
Pizarro Marcos D.
Taiwan Semiconductor Manufacturing Company , Ltd.
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