System for peeling semiconductor chips from tape

Details System for peeling semiconductor chips from tape System for peeling semiconductor chips from tape

2007-07-03

2007-07-03

Osele, Mark A. (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

C156S583200, C438S464000, C438S976000

Reexamination Certificate

active

10907991

ABSTRACT:
A system for peeling semiconductor chips from tape is provided with a nose on a housing. The nose has transverse dimensions smaller than the transverse dimensions of a target chip. Apertures are provided through the nose from the housing. Vacuum ports are provided in the housing adjacent the nose. A vacuum source controllably connects to the apertures and the vacuum ports. The nose is positioned adjacent a tape attached on the opposite side thereof to the target chip. Vacuum is applied to attract the tape against the nose and the adjacent portions of the housing to peel the tape from the peripheral edges of the target chip while supporting the tape in the center of the target chip.

REFERENCES:
patent: 6436795 (2002-08-01), Noguchi et al.
patent: 6607970 (2003-08-01), Wakabayashi
patent: 6709543 (2004-03-01), Kurosawa
patent: 6774011 (2004-08-01), Nakazawa
patent: 6824643 (2004-11-01), Yoshimoto et al.
patent: 6896762 (2005-05-01), Huang et al.
patent: 2002/0019074 (2002-02-01), Nakazawa et al.
patent: 2004/0038498 (2004-02-01), Ozono et al.
patent: 2004/0038499 (2004-02-01), Kim et al.
patent: 2005/0274457 (2005-12-01), Cheung et al.
patent: 62098638 (1987-05-01), None
patent: 04320046 (1992-11-01), None
patent: 10199961 (1998-07-01), None

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