System for mechanical planarization

Abrasive tool making process – material – or composition – With carbohydrate or reaction product thereof

Patent

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Details

51 48R, 51103R, 51104, 51105R, B24B 500, B24B 300

Patent

active

049341022

ABSTRACT:
A polishing tool for abrasively polishing a semiconductor wafer that edge clamps the wafer between two rollers. The wafer is spun-up in one plane and the rollers spin in a second plane which is orthogonal to the wafer spin plane. One of the rollers is split with each section rotating in opposite directions. Each of the rollers is mounted by a spring-gimballed assembly to follow the wafer contour.

REFERENCES:
patent: 1899463 (1933-02-01), Howard
patent: 2536444 (1951-01-01), Hamilton

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