System for encapsulation of semiconductor chips

Details System for encapsulation of semiconductor chips System for encapsulation of semiconductor chips

1982-01-11

1983-07-12

Kittle, John E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430321, 430324, G03C 500

Patent

active

043931308

ABSTRACT:
A system for encapsulating semiconductor chips, such as chips carrying chemical sensitive field-effect devices, includes lamination of a sheet of dry film photoresist material onto the surface of the chip, placement of a photomask over the chip in a predetermined alignment, and then exposure of the photomask to light so that light passes through certain light-transmitting portions of the mask onto the chip. The photoresist material is then developed to remove the material from over the gate regions of each of the field-effect devices to define windows in the material through which the gate regions are exposed. Chemical sensitive membrane systems may then be applied to the windows of the devices to cover the gate regions.

REFERENCES:
patent: 3832176 (1974-08-01), Verstraete et al.
patent: 4020830 (1977-05-01), Johnson et al.

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