Semiconductor device manufacturing: process – With measuring or testing
Patent
1997-03-10
1999-03-02
Niebling, John F.
Semiconductor device manufacturing: process
With measuring or testing
438 17, 438 18, 438 15, 438615, 324765, 324766, 324767, 324768, 324769, 257 48, H01L 2100
Patent
active
058770330
ABSTRACT:
A system for detecting certain improperly soldered electrical component connections to a printed circuit board includes methods and apparatus providing an automated means for detecting unsoldered component leads is disclosed. A connection pad divided into two portions, or land areas is bridged by the component lead when soldered. A test pad connected to one of the land areas provides a test point for detecting the presence or absence of an open circuit condition through the lead of an electrical component to a point in the circuit to which it is to be electrically connected.
REFERENCES:
patent: 4091529 (1978-05-01), Zaleckas
patent: 5308928 (1994-05-01), Parla et al.
patent: 5637835 (1997-06-01), Matern
Detweiler Sean D.
Martin Terrence
Morris Jules Jay
Niebling John F.
The Foxboro Company
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