Special receptacle or package – Holder for a removable electrical component – For a semiconductor wafer
Reexamination Certificate
2006-06-13
2006-06-13
Gehman, Bryon P. (Department: 3728)
Special receptacle or package
Holder for a removable electrical component
For a semiconductor wafer
C206S303000, C206S454000
Reexamination Certificate
active
07059475
ABSTRACT:
The invention relates to transport and shipping containers for wafers that are processed into semiconductor units. The wafer transport system provides wafer carriers that provide damage protection and particulate protection with minimal contamination of the wafers in the shipper. The invention includes a wafer cushion for cushioning semiconductor wafers that is made of a closed-cell polyethylene material with a surface resistivity of less than 5×107ohms per square that has less than 1800 ng/g Cl−, 400 ng/g F−/Acetate, 270 ng/g NO3−, 350 ng/g SO42−, and 60 ng/g PO43−ions leachable under moderate conditions. The wafer cushion optimally has no detectable outgassing organics under stringent conditions. The static control properties are the result of carbon that is part of the structure of the material.
REFERENCES:
patent: 4606463 (1986-08-01), Stavis
patent: 5273154 (1993-12-01), Braun
patent: 5525791 (1996-06-01), Krichever et al.
patent: 5553711 (1996-09-01), Lin et al.
patent: 5577616 (1996-11-01), Liang
patent: 5586658 (1996-12-01), Nyseth
patent: 5697751 (1997-12-01), Takahashi
patent: 5803269 (1998-09-01), Jacoby et al.
patent: 5816410 (1998-10-01), Nyseth
patent: 6070271 (2000-06-01), Williams
patent: 6082540 (2000-07-01), Krampotich et al.
patent: 6116684 (2000-09-01), Williams
patent: 6193068 (2001-02-01), Lewis et al.
patent: 6267245 (2001-07-01), Bores et al.
patent: 6341695 (2002-01-01), Lewis et al.
patent: 6533123 (2003-03-01), Nakamura et al.
patent: 6550619 (2003-04-01), Bores et al.
patent: 6564946 (2003-05-01), Lewis et al.
patent: WO 02/12379 (2002-02-01), None
Molitor David
Nicolas Matthew
Zabka Michael C.
Entegris, Inc.
Gehman Bryon P.
Patterson Thuente Skaar & Christensen P.A.
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