Abrading – Precision device or process - or with condition responsive... – With indicating
Patent
1998-05-29
1999-12-14
Eley, Timothy V.
Abrading
Precision device or process - or with condition responsive...
With indicating
451 43, 451339, B24B 4900
Patent
active
060009985
ABSTRACT:
A wafer edge grinding machine including a chuck rotatable about a first axis, a chuck basin having bottom and side walls surrounding the chuck and a fine aligner disposed over an open top of the basin and configured to deliver wafers to the chuck. The machine further includes a probe having a sensor contact surface and a shifting mechanism adapted to selectively withdraw the sensor contact surface to a storage position and extend the contact surface to a measurement position. The probe also includes a mounting structure adapted to secure the probe to one of the walls in the basin with the probe being mounted in the basis to position the contact surface adjacent the perimeter of a wafer disposed on the chuck. The shifting mechanism includes a remotely operable control adapted to allow a user to operate the shifting mechanism from a location remote from the basin.
REFERENCES:
patent: 4864779 (1989-09-01), Ozaki
patent: 5185965 (1993-02-01), Ozaki
patent: 5333413 (1994-08-01), Hashimoto
patent: 5609514 (1997-03-01), Yasunaga et al.
patent: 5658189 (1997-08-01), Kagamida
patent: 5741172 (1998-04-01), Trionfetti et al.
patent: 5807166 (1998-09-01), Bando
patent: 5839943 (1998-11-01), Stadfeld
patent: 5846121 (1998-12-01), Hayashi et al.
patent: 5868857 (1999-02-01), Moinpour et al.
patent: 5885131 (1999-03-01), Azarian et al.
patent: 5890949 (1999-04-01), Shibata
patent: 5904608 (1999-05-01), Watanabe
Eley Timothy V.
SEH America Inc.
LandOfFree
System for calibrating wafer edge-grinder does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System for calibrating wafer edge-grinder, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System for calibrating wafer edge-grinder will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-858050