Package making – With means responsive to a sensed condition – Separate delivery of incomplete or defective contents or...
Patent
1988-03-14
1990-03-06
Coan, James F.
Package making
With means responsive to a sensed condition
Separate delivery of incomplete or defective contents or...
53131, 324158F, G01R 3100
Patent
active
049054457
ABSTRACT:
A system for arranging chips in series in a tape capable of automatically and efficiently carrying out all steps from the feeding of chips to the arranging of them in series in recesses of a tape with high reliability. The system includes a chip feed section adapted to individually separate chips and automatically eliminate a chip defective in configuration while supplying chips, a first intermittently turned index table formed with chip receiving grooves for successively receiving chips one by one from the chip feed section and adapted to automatically eliminate a chip defective in electrical characteristics, and a chip transferring section for transferring chips from the first index table to a second intermittently turned index table. The second index table is formed with chip receiving grooves for successively receiving chips one by one from the chip transferring section. Chips are then taken out and arranged in recesses of an intermittently moving tape one by one by a suction pin. Around the first index table are arranged a chip measuring section for measuring electrical characteristics of a chip and a chip marking section for putting a mark or a value of measured electrical characteristics on a chip.
REFERENCES:
patent: 3059215 (1962-10-01), Proskauer
patent: 3627124 (1971-12-01), Hance et al.
patent: 3704418 (1972-11-01), Coffin
patent: 4053065 (1977-10-01), Kowalski et al.
patent: 4320339 (1982-03-01), Vancelette
patent: 4437229 (1984-03-01), Bitler et al.
Inomata Yoshio
Kumagai Osamu
Saitoh Kenichi
Coan James F.
TDK Corporation
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