System, apparatus and method of selective laser repair for...

Details System, apparatus and method of selective laser repair for... System, apparatus and method of selective laser repair for...

2008-08-13

2010-02-23

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Repair or restoration

C438S006000, C438S007000, C438S015000

Reexamination Certificate

active

07666690

ABSTRACT:
Exemplary embodiments of the selective laser repair apparatus and method may allow the repair of metal bumps in a semiconductor device stack by applying a laser beam to a damaged and/or defective bump. Metal bumps may be repaired and individual chips and/or packages forming a device stack need not be separated. The operation of a control unit and a driving unit may position a laser unit such that a laser beam may be irradiated at the damaged and/or defective metal bump. An X-ray inspection unit may obtain information about the damaged and/or defective metal bump.

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patent: 5012502 (1991-04-01), Battin et al.
patent: 5034591 (1991-07-01), Fang
patent: 5969799 (1999-10-01), Sano
patent: 6441339 (2002-08-01), Ueno
patent: 2004/0072387 (2004-04-01), Hong et al.
patent: 2002-016214 (2002-01-01), None
patent: JP 2002-016214 (2002-01-01), None
patent: 10-0325293 (2002-02-01), None
patent: JP 2003-309139 (2003-10-01), None

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