Electronic digital logic circuitry – Interface – Current driving
Reexamination Certificate
2005-05-16
2008-11-25
Barnie, Rexford (Department: 2819)
Electronic digital logic circuitry
Interface
Current driving
C326S086000
Reexamination Certificate
active
07456655
ABSTRACT:
A system and process overcomes the influence of induced current and/or capacitance in wires and, more particularly, reduces and overcomes induced current and/or capacitance cross-talk between neighboring wire-bonds. A change or toggle in each of a plurality of outputs from a circuit is determined. The change determined for one selected output is compared with the change determined for neighboring outputs. When the change for the neighboring outputs is both the same as that of the selected output, the output strength or the slew rate of an amplifier that receives the selected output is altered so that the output is increased. When the change for the neighboring outputs is both the opposite of that of the selected output, the output strength or the slew rate of an amplifier that receives the selected output is altered so that the output is decreased.
REFERENCES:
patent: 4113996 (1978-09-01), Sanderson
patent: 4605980 (1986-08-01), Hartranft et al.
patent: 5088016 (1992-02-01), Vinciarelli et al.
patent: 5181092 (1993-01-01), Atsumi
patent: 5428837 (1995-06-01), Bayrums et al.
patent: 5481555 (1996-01-01), Wade et al.
patent: 5546038 (1996-08-01), Croft
patent: 5646543 (1997-07-01), Rainal
patent: 5854504 (1998-12-01), Consiglio
patent: 5965920 (1999-10-01), Sung
patent: 6034552 (2000-03-01), Chang et al.
patent: 6061222 (2000-05-01), Morris et al.
patent: 6081164 (2000-06-01), Shigemori et al.
patent: 6107684 (2000-08-01), Busking et al.
patent: 6208225 (2001-03-01), Miller
patent: 6218706 (2001-04-01), Waggoner et al.
patent: 6232645 (2001-05-01), Belot
patent: 6317305 (2001-11-01), Dedic
patent: 6355970 (2002-03-01), Fujii
patent: 6387775 (2002-05-01), Jang et al.
patent: 6410381 (2002-06-01), Kim et al.
patent: 6559493 (2003-05-01), Lee et al.
patent: 6580286 (2003-06-01), Tennen
patent: 6625006 (2003-09-01), Aram et al.
patent: 6713836 (2004-03-01), Liu et al.
patent: 6743658 (2004-06-01), Corisis
patent: 6756664 (2004-06-01), Yang
patent: 6757967 (2004-07-01), Jimarez et al.
patent: 6769923 (2004-08-01), Caldwell
patent: 6778398 (2004-08-01), Wyland
patent: 6781242 (2004-08-01), Fan et al.
patent: 6784050 (2004-08-01), Aram et al.
patent: 6790710 (2004-09-01), McLellan et al.
patent: 6791429 (2004-09-01), Mikalauskas
patent: 6794702 (2004-09-01), Park
patent: 6803252 (2004-10-01), Lao et al.
patent: 6813486 (2004-11-01), Sayers
patent: 6818472 (2004-11-01), Fan et al.
patent: 6825572 (2004-11-01), Tian et al.
patent: 6831479 (2004-12-01), Lo
patent: 7098686 (2006-08-01), Kong et al.
patent: 2003/0183403 (2003-10-01), Kluge et al.
patent: 2003/0227296 (2003-12-01), Lee
patent: 2004/0012457 (2004-01-01), Soltan et al.
U.S. Appl. No. 10/397,402, filed Mar. 26, 2003; Inventor: Xiaodong Jin, Lawrence Tse, King Chun Tsai, George Chien and Shuran Wei.
U.S. Appl. No. 11/033,202, filed Jan. 11, 2005; Inventors: Xiaodong Jin, Lawrence Tse, King Chun Tsai, George Chien and Shuran Wei.
U.S. Appl. No. 11/034,093, filed Jan. 12, 2005; Inventors: Xiaodong Jin, Lawrence Tse, King Chun Tsai, George Chien and Shuran Wei.
U.S. Appl. No. 11/034,979, filed Jan. 13, 2005; Inventors: Xiaodong Jin, Lawrence Tse, King Chun Tsai, George Chien and Shuran Wei.
U.S. Appl. No. 11/125,490, filed May 9, 2005; Inventor: Liav Ben Artsi.
U.S. Appl. No. 10/397,454, filed Mar. 26, 2003; Inventors: Xiadong Jin, Lawrence Tse, King Chun Tsai, Sehat Sutaroja.
Barnie Rexford
Marvell Israel (MISL) Ltd.
Tran Thienvu V
LandOfFree
System and process for overcoming wire-bond originated... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System and process for overcoming wire-bond originated..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and process for overcoming wire-bond originated... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4049920