System and methods for wafer charge reduction for ion implantati

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

250423R, 31511181, G21K 500

Patent

active

048250872

ABSTRACT:
A diode flood gun for introducing an amplified current of low energy electrons into an ion beam for neutralizing charge build up on a target such as a semiconductor wafer during irradiation by the beam. The low energy, amplified current is effected by introducing an inert gas into the flood gun.

REFERENCES:
patent: 3507709 (1970-04-01), Bowers
patent: 4463255 (1984-07-01), Robertson et al.
patent: 4578589 (1986-03-01), Aitken
patent: 4684848 (1987-08-01), Kaufman et al.
Glawischnig et al., "Charging Studies in New Applied Materials Series 9000 Ion Implantation System", Jan. 1987 Nuclear Instruments publication, pp. 1-4, FIGS. 1-4.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System and methods for wafer charge reduction for ion implantati does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and methods for wafer charge reduction for ion implantati, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and methods for wafer charge reduction for ion implantati will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1197646

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.