Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate
2006-10-10
2006-10-10
Ghyka, Alexander (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
C257S072000, C257SE27111, C257SE29290
Reexamination Certificate
active
07119391
ABSTRACT:
The invention provides a substrate device having thin film transistors (TFTs), each including a semiconductor layer and capacitors formed above the TFTs, that are provided on a substrate. Each of the capacitors can include a first electrode electrically connected to a part of the semiconductor layer, a second electrode arranged to face the first electrode, and a dielectric film including a nitride film arranged between the first electrode and the second electrode on the substrate. Further, the nitride film has an aperture facing the semiconductor layer as seen in plan view. Accordingly, it is possible to effectively hydrogenate the semiconductor layer using the aperture.
REFERENCES:
patent: 6597413 (2003-07-01), Kurashina
patent: 6781651 (2004-08-01), Song et al.
patent: 6835955 (2004-12-01), Iki et al.
patent: A-04-022127 (1992-01-01), None
patent: 05-129333 (1993-05-01), None
patent: A-09-061851 (1997-03-01), None
patent: A-10-197897 (1998-07-01), None
patent: A-10-274789 (1998-10-01), None
patent: 11-354811 (1999-12-01), None
patent: A-2000-010120 (2000-01-01), None
patent: A-2001-013518 (2001-01-01), None
patent: A-2001-066631 (2001-03-01), None
patent: A-2001-066638 (2001-03-01), None
patent: A-2002-057341 (2002-02-01), None
patent: 2002-094072 (2002-03-01), None
patent: A-2002-090721 (2002-03-01), None
patent: A-2002-098409 (2002-04-01), None
patent: A-2002-131778 (2002-05-01), None
patent: WO 01/82273 (2001-11-01), None
Hayashi Tomohiko
Iki Takunori
Ghyka Alexander
Oliff & Berridg,e PLC
Seiko Epson Corporation
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