Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate
2006-10-24
2006-10-24
Le, Thao X. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With dam or vent for encapsulant
C257S704000, C257S782000, C257S683000
Reexamination Certificate
active
07126210
ABSTRACT:
A system and method is disclosed for venting pressure from an integrated circuit package that is sealed with a lid. During a surface mount process for mounting a ball grid array integrated circuit package to a circuit board the application of heat (1) weakens the solder that seals a soldered lid, and (2) increases vapor pressure within the integrated circuit package. This may cause the soldered lid to move out of its soldered position. The present invention solves this problem by providing an integrated circuit with a solder mask that has a plurality of solder mask vents that form a plurality of vapor pressure vents through the solder. The vapor pressure vents prevent the occurrence of any increase in vapor pressure that would shift the soldered lid out of its soldered position. An alternate embodiment vents pressure through an epoxy layer that is used to attach a lid by epoxy.
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Chiu Anthony M.
Lao Tom Q.
Le Thao X.
Munck William A.
STMicroelectronics Inc.
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