Etching a substrate: processes – Nongaseous phase etching of substrate – Etching inorganic substrate
Reexamination Certificate
2006-09-12
2006-09-12
Deo, Duy-Vu N. (Department: 1765)
Etching a substrate: processes
Nongaseous phase etching of substrate
Etching inorganic substrate
C438S745000, C438S753000, C252S079200
Reexamination Certificate
active
07105103
ABSTRACT:
A method for manufacturing surgical blades from either a crystalline or poly-crystalline material, preferably in the form of a wafer, is disclosed. The method includes preparing the crystalline or poly-crystalline wafers by mounting them and machining trenches into the wafers. The methods for machining the trenches, which form the bevel blade surfaces, include a diamond blade saw, laser system, ultrasonic machine, and a hot forge press. The wafers are then placed in an etchant solution which isotropically etches the wafers in a uniform manner, such that layers of crystalline or poly-crystalline material are removed uniformly, producing single or double bevel blades. Nearly any angle can be machined into the wafer which remains after etching. The resulting radii of the blade edges is 5–500 nm, which is the same caliber as a diamond edged blade, but manufactured at a fraction of the cost.
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Daskal Vadim Mark
Hughes James Joseph
Keenan Joseph Francis
Becton Dickinson and Company
Deo Duy-Vu N.
Murtha James J.
Roylance Abrams Berdo & Goodman LLP
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