System and method for the manufacture of surgical blades

Details System and method for the manufacture of surgical blades System and method for the manufacture of surgical blades

2011-03-15

2011-03-15

Deo, Duy-Vu N. (Department: 1713)

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

C438S750000, C438S572000

Reexamination Certificate

active

07906437

ABSTRACT:
A method for manufacturing surgical blades from either a crystalline or poly-crystalline material, preferably in the form of a wafer, is disclosed. The method includes preparing the crystalline or poly-crystalline wafers by mounting them and machining trenches into the wafers. The methods for machining the trenches, which form the bevel blade surfaces, include a diamond blade saw, laser system, ultrasonic machine, and a hot forge press. The wafers are then placed in an etchant solution which isotropically etches the wafers in a uniform manner, such that layers of crystalline or poly-crystalline material are removed uniformly, producing single or double bevel blades. Nearly any angle can be machined into the wafer which remains after etching. The resulting radii of the blade edges is 5-500 nm, which is the same caliber as a diamond edged blade, but manufactured at a fraction of the cost.

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