System and method for split package power and rotational...

Details System and method for split package power and rotational... System and method for split package power and rotational...

2005-04-05

2005-04-05

Zarneke, David A. (Department: 2829)

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

Reexamination Certificate

active

06875625

ABSTRACT:
A microelectronic device is provided including an integrated circuit mounted to a substrate. A break through multiple conductive layers of the substrate corresponds to a break in the power planes of the integrated circuit. The breaks in the substrate and in the integrated circuit allow for a rotational burn-in of a first portion and a second portion of the integrated circuit.

REFERENCES:
patent: 6323664 (2001-11-01), Kim et al.
patent: 6476629 (2002-11-01), Bjork
patent: 6580283 (2003-06-01), Carbone et al.

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