System and method for removing particles in semiconductor...

Brushing – scrubbing – and general cleaning – Electrostatic cleaning

Reexamination Certificate

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C015S004000, C361S230000

Reexamination Certificate

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08046860

ABSTRACT:
A system for semiconductor wafer manufacturing, comprises a chamber process path for processing the wafer, and a device operable to remove particles from the wafer by electrostatic and electromagnetic methodologies wherein the device is installed in the chamber process path.

REFERENCES:
patent: 5231622 (1993-07-01), Hayashi
patent: 5350428 (1994-09-01), Leroux et al.
patent: 6495215 (2002-12-01), Kamikawa
patent: 2002/0134399 (2002-09-01), Taylor

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