Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
Reexamination Certificate
2005-08-16
2010-10-26
Deo, Duy-Vu N (Department: 1713)
Cleaning and liquid contact with solids
Processes
Including application of electrical radiant or wave energy...
C134S001300, C438S706000
Reexamination Certificate
active
07819980
ABSTRACT:
A system for semiconductor wafer manufacturing, comprises a chamber process path for processing the wafer, and a device operable to remove particles from the wafer by electrostatic and electromagnetic methodologies wherein the device is installed in the chamber process path.
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patent: 2003/0184720 (2003-10-01), Heerens et al.
Chang Ching-Yu
Chang Shih-Ming
Hsia Chen-Yuan
Huang Yen-Bin
Hung Chang-Cheng
Deo Duy-Vu N
Haynes and Boone LLP
Taiwan Semiconductor Manufacturing Company , Ltd.
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