System and method for removing an organic film from a...

Plastic and nonmetallic article shaping or treating: processes – Laser ablative shaping or piercing

Reexamination Certificate

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C156S345420, C600S373000, C264S482000

Reexamination Certificate

active

07833463

ABSTRACT:
In one embodiment, a method of removing an organic film from a selected portion of an implantable medical device includes: selecting a portion of an implantable medical device from which to remove an organic film comprising a silane primer and a polymer of para-xylylene; using a laser set at a first value for an operational parameter, tracing the perimeter of the selected portion to ablate the organic film along the perimeter; using an infrared laser set at a second value for the operational parameter, scanning the selected portion of the device to heat the surface of the device within the perimeter of the selected portion and thereby separate the organic film from the surface of the device within the perimeter of the selected portion; and mechanically removing the chemically separated organic film from the surface of the device within the perimeter to expose the selected portion.

REFERENCES:
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patent: 5534094 (1996-07-01), Arjavalingam et al.
patent: 6231566 (2001-05-01), Lai
patent: 6254634 (2001-07-01), Anderson et al.
patent: 6299604 (2001-10-01), Ragheb et al.
patent: 2001/0026309 (2001-10-01), Takeyama
patent: 2004/0063805 (2004-04-01), Pacetti et al.
patent: 2005/0019371 (2005-01-01), Anderson et al.
TRUMPF Laser Marking Systems, Brochure, TRUMPH Inc. Farmington, CT, http://www.us.trumph.com.

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