Abrading – Precision device or process - or with condition responsive... – Computer controlled
Patent
1993-08-25
1996-01-23
Rachuba, Maurina T.
Abrading
Precision device or process - or with condition responsive...
Computer controlled
451 6, 451 10, 451 21, 451 55, 451287, 451290, B24B 4900
Patent
active
054861292
ABSTRACT:
A system for polishing a semiconductor wafer includes a rotatable platen subassembly and a drive mechanism coupled to rotate the platen subassembly at a platen velocity. A polishing head supports and holds a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face whereby individual regions of the wafer face have different polishing rates. The polishing head includes pressure applicators for applying various localized pressures on the individual regions of the semiconductor wafer to conform the wafer face to a selected contour. The system also includes a polish control subsystem for monitoring in situ the polishing rates at various regions of the semiconductor wafer. The polish control subsystem adjusts in situ the platen velocity and/or the individual localized pressures applied to the semiconductor wafer to change the polishing rates of the individual regions of the semiconductor wafer. The system can also be adapted to change other operational parameters, such as wafer velocity, wafer polishing path across the platen, slurry composition and flow rate (for CMP processes), and force applied to the wafer when contacting the platen. A method for polishing a semiconductor wafer is also described.
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Doan Trung T.
Sandhu Gurtej S.
Micro)n Technology, Inc.
Rachuba Maurina T.
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