System and method for quantifying uniformity patterns for...

Details System and method for quantifying uniformity patterns for... System and method for quantifying uniformity patterns for...

2005-07-26

2005-07-26

Bahta, Kidest (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S098000, C700S182000

Reexamination Certificate

active

06922603

ABSTRACT:
A system and method of determining multiple uniformity metrics of a semiconductor wafer includes quantitatively defining a location metric of a nonuniformity on the surface of the wafer. A quantity is measured at multiple locations on a top surface of the wafer and a center of mass is of the nonuniformity is determined.

REFERENCES:
patent: 5640237 (1997-06-01), Esrig et al.
patent: 5751582 (1998-05-01), Saxena et al.
patent: 6392745 (2002-05-01), Mavliev et al.
patent: 6665623 (2003-12-01), Pasadyn et al.
patent: 6706541 (2004-03-01), Toprac et al.
N.R. Draper, H. Smith, “Applied Regression Analysis”, pp. 530-535, Second Edition, John Wiley & Sons.
Michael Nikolaou, Andrew D. Bailey, III, “Application of Reduced-Rank Multivariate Methods To The Monitoring Of Spatial Uniformity Of Wafer Etching”, pp. 1-6.

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