System and method for providing a conductive circuit pattern uti

Details System and method for providing a conductive circuit pattern uti System and method for providing a conductive circuit pattern uti

1989-04-11

1990-03-20

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156652, 1566591, 156666, 156902, 156345, 21912169, 21912185, 427 531, 427 96, B44C 122, C23F 102, C03C 1500, C03C 2506

Patent

active

049098950

ABSTRACT:
A system and method for improved conductive circuit patterning utilizing laser ablation is disclosed. In an embodiment, a substrate, which has an electroless conductive layer plated thereon, is heated to a predetermined temperature for a predetermined time to form an oxide layer upon the conductive layer. The oxide layer, due to its non-absorptive properties, is more easily ablated than the conductive layer. Hence, the overall processing time for circuit patterning is significantly reduced.

REFERENCES:
patent: 4622095 (1986-11-01), Grobman et al.
patent: 4834834 (1989-05-01), Ehrlich et al.

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