System and method for protecting microelectromechanical...

Details System and method for protecting microelectromechanical... System and method for protecting microelectromechanical...

2005-03-25

2008-05-06

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With thin active central semiconductor portion surrounded by...

C257S678000, C257S690000, C257S730000, C257S773000, C257S776000, C257SE33065, C257SE33068, C257SE23143, C257SE23146, C257SE23194

Reexamination Certificate

active

07368803

ABSTRACT:
Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate, an interferometric modulation display array formed on the substrate, and a back-plate. The back-plate is placed over the display array with a gap between the back-plate and the display array. The depth of the gap may vary across the back-plate. The back-plate can be curved or have a recess on its interior surface facing the display array. Thickness of the back-plate may vary. The device may include reinforcing structures which are integrated with the back-plate.

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