Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2005-01-25
2005-01-25
Clark, S. V. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257S795000, C438S127000, C438S617000
Reexamination Certificate
active
06847122
ABSTRACT:
A method of packaging a semiconductor device including a plurality of elements is provided. The method includes applying an insulative material to at least a portion of the semiconductor device, where the insulative material includes insulative particles having a diameter smaller than a gap between adjacent conductors providing interconnection between the elements. The method also includes curing the insulative material.
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Hmiel, A., et al., “Wire Bond Short Reduction By Encapsulation”, SEMI Technology Symposium: International Electronics Manufacturing Technology Symposium, 2003, SEMICON West, San Jose CA.
Batish Rakesh
Hmiel Andrew
Kulicke C. Scott
VonSeggern Walt
Clark S. V.
Kulicke & Soffa Investments Inc.
RatnerPrestia
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