4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Wire contact, lead, or bond

Andrew Hmiel

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Probe tip plating

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Utilizing brush or absorbent applicator
Reexamination Certificate

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System and method for preventing and alleviating short...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2801253

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