System and method for power domain optimization

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

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C716S030000, C716S030000, C716S030000, C716S030000

Reexamination Certificate

active

07844925

ABSTRACT:
A method for electronic circuit power plane design includes analyzing direct current (DC) properties of a power plane of an electronic circuit. The method includes analyzing power net inductance (PNI) properties of the power plane and identifying victim areas of the power plane having predetermined current density properties based on the DC properties and the PNI properties of the power plane. The method further includes replacing the identified victim areas with ground (GND) shapes to form a modified power plane.

REFERENCES:
patent: 2007/0188997 (2007-08-01), Hockanson et al.
Huber et al.; “Power Distribution Analysis for IBM eServer System Integration Optimization”; 2004; IBM Corporation; All Pages.
Wang et al.; “EBG-Enhanced Split Power Planes for Wideband Noise Suppression”; 2005; IEEE; All Pages.
Kim et al.; “An Efficient Path-Based Equivalent Circuit Model for Design, Synthesis, and Optimization of Power Distribution Networks in Multilayer Printed Circuit Boards”; 2004; IEEE; All Pages.
Kamgaing et al.; “A Novel Power Plane with Integrated Simultaneous Switching Noise Mitigation Capability Using High Impedance Surface”; 2003; IEEE; All Pages.
Cui et al.; “DC Power-Bus Noise Isolation with Power-Plane Segmentation”; 2003; IEEE; All Pages.
McFiggins et al.; “Generalized Analytical Model for the Design of Irregularly Shaped Power Planes and Passives in Mixed Signal Applications”; 2004; IEEE; All Pages.
Fan et al.; “Modeling DC Power-Bus Structures with Vertical Discontinuities Using a Circuit Extraction Approach Based on a Mixed-Potential Integral Equation Formulation”; May 2001; IEEE Transactions on Advanced Packaging, vol. 24; pp. 143-157.
Lee et al.; “Optimized Design of Distributed Power Systems for High Efficiency, High Power Density and Low EMI Noise”; Jun. 2006; IEEE Intelec conference; pp. 1-12.
Smith et al.; “Power Plane SPICE Models and Simulated Performance for Materials and Geometries”; Aug. 2001; IEEE Transactions on Advanced Packaging, vol. 24; pp. 277-287.

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