Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2009-04-29
2011-11-29
Pham, Hoai V (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000, C257SE25006, C257SE25013
Reexamination Certificate
active
08067829
ABSTRACT:
A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder “bumps,” which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.
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Ebel Christopher
Hughes John A.
Lee David H.
Lemoine Eugene
Love Thomas E.
BAE Systems Information and Electronic Systems Integration Inc.
Graybeal Jackson LLP
Pham Hoai V
Rusyn Paul F.
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