System and method for mounting electrical devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

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Details

C257S690000, C257S691000, C257S698000, C257S734000, C257SE23001, C257SE23194, C257SE21499

Reexamination Certificate

active

11030022

ABSTRACT:
In one embodiment an electronic device, such as an optical sensor, is attached to a substrate upon which wire logouts and, if desired, other components are constructed. A frame, or cover, is attached to the substrate surrounding the attached device. An aperture in the cover allows wireless signals to pass in or out of the cover.

REFERENCES:
patent: 5852320 (1998-12-01), Ichihashi
patent: 6037655 (2000-03-01), Philbrick et al.
patent: 6593663 (2003-07-01), Ikezawa et al.
patent: 6768196 (2004-07-01), Harney et al.
patent: 6798031 (2004-09-01), Honda et al.
patent: 6864554 (2005-03-01), Lin et al.
patent: 6946714 (2005-09-01), Waitl et al.
patent: 53-80988 (1978-07-01), None

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