Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1993-05-13
1995-03-21
Powell, William
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156643, 156657, 156662, 156345, H01L 21306, B44C 122
Patent
active
053992296
ABSTRACT:
A system (60) and method for monitoring, evaluating and controlling the uniformity of a semiconductor wafer fabrication process is provided for use in manufacturing integrated circuits on semiconductor wafers (40). By using in situ ellipsometry (20) in conjunction with statistical modeling methods, the spatial etch rate pattern across a semiconductor wafer (40) may be inferred as a function of the process conditions. A predicted mean etch rate may be calculated for other locations (46 and 48) on the semiconductor wafer surface (42) by using the mean etch rate measured at the selected ellipsometer site (44) and individual spatial etch rate models developed for each site (44 and 48) based on statistically designed experiments. The predicted mean etch rate at the other sites (46 and 48) is also a function of the fabrication process conditions. The method for evaluating uniformity may be used with fabrication processes such as oxidation, doping, etching or any other process which may be measured in situ at a selected location (44) on a semiconductor wafer (40) during the fabrication process.
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Butler Stephanie W.
Stefani Jerry A.
Donaldson Richard L.
Hiller William E.
Powell William
Sorensen Douglas A.
Texas Instruments Incorporated
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