System and method for locating dies cut from a silicon wafer on

Details System and method for locating dies cut from a silicon wafer on System and method for locating dies cut from a silicon wafer on

1997-11-12

1999-08-03

Grant, William

Boots, shoes, and leggings

36446815, 364490, 36446801, 36446821, 438460, 438462, 148DIG28, 356375, 356376, G06F 1900, G01B 1114

Patent

active

059333510

ABSTRACT:
A method for locating dies (70) cut from a silicon wafer (54) on a wafer table (14) is provided. The method includes removing a first group of dies (70) with a robot assembly (16). Wafer location data (62) is then generated from the location (66, 68) of the first group of dies (70). Continuous wafer edge coordinates are then determined from the wafer location data (62).

REFERENCES:
patent: 4914601 (1990-04-01), Smyth, Jr.
patent: 5362681 (1994-11-01), Roberts, Jr. et al.
patent: 5706201 (1998-01-01), Andrews

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