Cleaning and liquid contact with solids – Apparatus – Automatic controls
Reexamination Certificate
2007-08-07
2007-08-07
Perrin, Joseph L. (Department: 1746)
Cleaning and liquid contact with solids
Apparatus
Automatic controls
C134S095200, C134S099100, C134S902000
Reexamination Certificate
active
10606022
ABSTRACT:
A system and method for processing a wafer includes applying a process to the wafer. The process being supported by a surface tension gradient device. A result of the process is monitored. The monitored result is output.
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Owa, et al., “Immersion Lithography; Its Potential Performance and Issues,”Proceedings of the SPIE, SPIE, Bellingham, VA, vol. 5040, No. 1, Feb. 28, 2003, pp. 724-733, XP002294500, ISSN: 0277-786X.
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Boyd John M.
de Larios John M.
Ravkin Michael
Redeker Fred C.
Lam Research Corporation
Martine & Penilla & Gencarella LLP
Perrin Joseph L.
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