System and method for inspecting errors on a wafer

Image analysis – Applications – Manufacturing or product inspection

Reexamination Certificate

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Details

C324S750010, C382S149000, C382S218000, C716S030000

Reexamination Certificate

active

07469057

ABSTRACT:
A method and system is disclosed for inspecting defects on a wafer. After acquiring at least one digitized image of at least one portion of a wafer, at least one design database file corresponding to the portion of the wafer is converted into at least one inspection file. After setting one or more error detection thresholds, the digitized image and the inspection file are compared by an inspection tool for detecting defects with regard to the portion of the wafer based on the set error detection thresholds.

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