System and method for increasing the strength of a bond made...

Details System and method for increasing the strength of a bond made... System and method for increasing the strength of a bond made...

2005-06-21

2005-06-21

Tran, Michael (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000, C438S109000, C438S125000

Reexamination Certificate

active

06908787

ABSTRACT:
A system and method is disclosed for increasing the strength of a bond made by a small diameter wire in ball bonding. In one embodiment of the invention a structure for receiving a ball bond comprises substrate material that has portions that form a substrate cavity and a wire bond pad that covers and fills the substrate cavity. The wire bond pad also has portions that form a wire bond cavity for receiving the ball bond. The ball is wirebonded to the sides and bottom of the wire bond cavity. The sides of the wire bond cavity provide additional strength to the bond to resist shear and tensile forces that may act on the wire.

REFERENCES:
patent: 6478212 (2002-11-01), Engel et al.
patent: 6555440 (2003-04-01), Geefay
patent: 11297746 (1999-10-01), None
patent: 2002246411 (2002-08-01), None

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