System and method for heating and cooling wafer at...

Coating apparatus – Gas or vapor deposition – With treating means

Reexamination Certificate

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C118S724000

Reexamination Certificate

active

10619731

ABSTRACT:
A highly dynamic heating and/or chilling chamber for processing semiconductor wafers. The chamber has uniform heat and gas flow distribution in order to minimize the temperature gradient at different points of the wafer.

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