System and method for forming a controlled impedance flex circui

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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174254, 174256, 174258, 174259, 361749, 361750, 361794, H05K 100

Patent

active

054480205

ABSTRACT:
A system and method for providing a controlled impedance flex circuit includes providing an insulative flexible substrate having opposed first and second surfaces and having through holes extending from the first surface to the second surface. A pattern of conductive traces is formed on the first surface of the flexible substrate. A film of conductive adhesive is applied to the second surface and to the through holes. The through holes are aligned to contact ground traces in the pattern of conductive traces on the first surface. Thus, a ground plane is established for creating an environment for high frequency signal propagation. The conductive adhesive may be a b-stage epoxy or a thermoplastic material. In the preferred embodiment, a tape automated bonding frame is fabricated.

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patent: 5142351 (1992-08-01), Matta
patent: 5208188 (1993-05-01), Newman
patent: 5367196 (1994-11-01), Mahulikar et al.

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