Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1985-02-08
1987-05-05
Niebling, John F.
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
204298, 20419215, C23C 1434
Patent
active
046630090
ABSTRACT:
A sealed substrate processing path has plural selectably isolatable vacuum deposition chambers along the path. A transporter carries substrates along the path and an independently controllable sputter deposition is performed in each deposition chamber on substrates therein. Substrates are loaded from a load chamber to a first deposition chamber while a vacuum is maintained in the first and load chambers. Substrates are transferred from a last deposition chamber to an unload chamber while a vacuum is maintained in the last and load chambers. Substrates are placed in the load chamber while the load and first chambers are isolated and are removed from the unload chamber while the last and unload chambers are isolated. In one embodiment, substrates travel succesively from the load chamber to first through fourth deposition chambers and then to the unload chamber. In another embodiment, substrates travel from the load chamber to first to second to first and to third deposition chambers and then to the unload chamber. First and second alternating load chambers are provided in another embodiment with substrates being loaded into the second load chamber while substrates are transferred from the first load chamber to the first deposition chamber and vice versa. The respective first and second load chambers are coupled through an interface chamber to the first deposition chamber and are each isolatable from the interface chamber during loading.
REFERENCES:
patent: 3584847 (1971-06-01), Hammond et al.
patent: 4236946 (1980-12-01), Aboaf et al.
patent: 4274936 (1981-06-01), Love
patent: 4313815 (1982-02-01), Graves et al.
patent: 4379743 (1983-04-01), Nakatsukasa et al.
patent: 4410407 (1983-10-01), Macaulay
patent: 4426265 (1984-01-01), Brunsch et al.
patent: 4500407 (1985-02-01), Boys et al.
patent: 4505950 (1985-03-01), Yamazaki
Bloomquist Darrel R.
Drennan George A.
Jacobson Michael B.
Lawton Robert J.
Opfer James E.
Hewlett--Packard Company
Murray Leslie G.
Nguyen Nam X.
Niebling John F.
LandOfFree
System and method for depositing plural thin film layers on a su does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System and method for depositing plural thin film layers on a su, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for depositing plural thin film layers on a su will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2397702