System and method for depositing a seed layer

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE21161, C257SE21596, C438S608000

Reexamination Certificate

active

07410893

ABSTRACT:
A method for depositing a seed layer for a controllable electric pathway on a substrate includes selectively dispensing a seed material from an inkjet material dispenser onto said substrate.

REFERENCES:
patent: 3993799 (1976-11-01), Feldstein
patent: 7067843 (2006-06-01), Carcia et al.
patent: 2002/0157271 (2002-10-01), Ekholm et al.
patent: 2002/0187895 (2002-12-01), Izaki et al.
patent: 2003/0175411 (2003-09-01), Kodas et al.
patent: 2003/0180451 (2003-09-01), Kodas et al.
patent: 2003/0228743 (2003-12-01), Fukunaga et al.
patent: 2003/0230967 (2003-12-01), Kawamura et al.
patent: 2004/0023253 (2004-02-01), Kunwar et al.
patent: 2004/0038808 (2004-02-01), Hampden-Smith et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System and method for depositing a seed layer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method for depositing a seed layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for depositing a seed layer will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4015865

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.