System and method for depositing a material on a substrate

Details System and method for depositing a material on a substrate System and method for depositing a material on a substrate

2011-06-28

2011-06-28

Meeks, Timothy H (Department: 1715)

Coating processes

Coating by vapor, gas, or smoke

C118S719000, C118S726000

Reexamination Certificate

active

07968145

ABSTRACT:
A method and apparatus for depositing a film on a substrate includes introducing a material and a carrier gas into a heated chamber. The material may be a semiconductor material, such as a cadmium chalcogenide. A resulting mixture of vapor and carrier gas containing no unvaporized material is provided. The mixture of vapor and carrier gas are remixed to achieve a uniform vapor/carrier gas composition, which is directed toward a surface of a substrate, such as a glass substrate, where the vapor is deposited as a uniform film.

REFERENCES:
patent: 3858548 (1975-01-01), Tick
patent: 3954423 (1976-05-01), Hamper et al.
patent: 3966127 (1976-06-01), Pytlewski
patent: 4512868 (1985-04-01), Fujimura et al.
patent: 4606776 (1986-08-01), Salis
patent: 4987284 (1991-01-01), Fujimura et al.
patent: 5445973 (1995-08-01), Hedström
patent: 5837320 (1998-11-01), Hampden-Smith et al.
patent: 5994642 (1999-11-01), Higuchi et al.
patent: 6037241 (2000-03-01), Powell et al.
patent: 6444043 (2002-09-01), Gegenwart et al.
patent: 6660328 (2003-12-01), Dahmen et al.
patent: 2002/0129769 (2002-09-01), Kim et al.
patent: 2004/0031442 (2004-02-01), Yamazaki et al.
US Pat 4,606,776—Derwent abstract.

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