System and method for controlling manufacturing processes,...

Data processing: measuring – calibrating – or testing – Measurement system – Performance or efficiency evaluation

Reexamination Certificate

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C250S306000

Reexamination Certificate

active

11086220

ABSTRACT:
A control system for a manufacturing process includes an inspection tool inspecting a dislocation image in semiconductor substrate processed by manufacturing processes; an inspection information input module configured to acquire the inspected dislocation image; a process condition input module acquiring process conditions of the manufacturing processes; a structure information input module acquiring structure of the semiconductor substrate processed by target manufacturing process; a stress analysis module calculating stresses at nodes provided in the structure, based on target process condition and the structure; an origin setting module providing origins at positions where stress concentration having stress value not less than reference value is predicted; a dislocation dynamics analysis module calculating dislocation pattern in stress field for each position of the origins; and a dislocation pattern comparison module comparing the dislocation pattern with the inspected dislocation image so as to determine whether the target manufacturing process is critical manufacturing process.

REFERENCES:
patent: 2003/0168596 (2003-09-01), Sasajima et al.
Schwarz; “Simulation of Dislocations on the Mesoscopic Scale. I. Methods and Examples”; Journal of Applied Physics, vol. 85, No. 1, pp. 108-119, (1999).

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