System and method for controlling integrated circuit die...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE21514

Reexamination Certificate

active

07456050

ABSTRACT:
A system and method is disclosed for controlling a height and a planarity of an integrated circuit die. In one advantageous embodiment of the invention, a plurality of patterned metal stops are fabricated on an integrated circuit substrate and covered with die attach material. An integrated circuit die is inserted into the die attach material and placed into a clamping mechanism of a molding machine. The clamping mechanism (1) compresses the die into the die attach material, (2) rotates the die into parallel alignment with the substrate, and (3) pushes the die into contact with the patterned metal stops. In this manner the die height and the die planarity are precisely controlled.

REFERENCES:
patent: 5642265 (1997-06-01), Bond et al.
patent: 5756380 (1998-05-01), Berg et al.
patent: 6208020 (2001-03-01), Minamio et al.
patent: 6274823 (2001-08-01), Khandros et al.
patent: 6338984 (2002-01-01), Minamio et al.
patent: 6355507 (2002-03-01), Fanworth
patent: 6396292 (2002-05-01), Hembree et al.
patent: 6472758 (2002-10-01), Glenn et al.
patent: 6507104 (2003-01-01), Ho et al.
patent: 6580167 (2003-06-01), Glenn et al.
patent: 6686227 (2004-02-01), Zhou et al.
patent: 6815262 (2004-11-01), Hundt et al.
patent: 6853089 (2005-02-01), Ujiie et al.
patent: 6919420 (2005-07-01), Buchwalter et al.
patent: 6987032 (2006-01-01), Fan et al.
patent: 2002/0029857 (2002-03-01), Yamada
patent: 2003/0099097 (2003-05-01), Mok et al.
patent: 2003/0140678 (2003-07-01), Siegel et al.
patent: 2003/0143406 (2003-07-01), Siegel et al.
patent: 2004/0135266 (2004-07-01), Koh
patent: 2004/0241905 (2004-12-01), Hundt et al.
patent: 01-199440 (1989-08-01), None
“Manufacture Of Semiconductor Device”, Patent Abstracts of Japan, Tomohiko et al., Publication No. 01-199440 (Aug. 10, 1989).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System and method for controlling integrated circuit die... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method for controlling integrated circuit die..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method for controlling integrated circuit die... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4051397

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.