System and method for controlling an electrochemical etch...

Details System and method for controlling an electrochemical etch... System and method for controlling an electrochemical etch...

2011-08-09

2011-08-09

Maldonado, Julio J (Department: 2823)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Optical characteristic sensed

C438S669000, C438S746000, C216S084000, C257SE21525

Reexamination Certificate

active

07993936

ABSTRACT:
By evaluating a status signal on the basis of a fault detection classification mechanism in an electrochemical etch tool, a corresponding failure status of the tool may be obtained for each single substrate, thereby significantly reducing the risk of significant yield loss compared to conventional strategies. The fault detection and classification mechanism may be advantageously applied to the electrochemical removal of underbump metallization layers during the formation of solder bump structures.

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Translation of Official Communication from German Patent Office for German Patent Application No. 10 2006 062 037.2 dated Jan. 9, 2009.

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