System and method for cleaning nozzle delivering spin-on-glass t

Coating processes – Spraying – Moving the base

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Details

118302, 118 52, 118320, B05D 102, B05B 716

Patent

active

059585170

ABSTRACT:
A system (12) for delivering spin-on-glass (SOG) to a substrate (14) has a spin chuck (16) for spinning a substrate (14), a delivery nozzle (18, 118, 218, 318, 418) having an interior conduit (419), a delivery nozzle-positioning subsystem (62) coupled to the delivery nozzle (18, 118, 218, 318, 418) for selectively positioning the delivery nozzle (18, 118, 218, 318, 418) over the spin chuck (16) for delivery of SOG, a SOG supply line (60, 160, 360) for supplying SOG, a cleaning fluid supply line (22, 122, 322) for supplying a cleaning fluid used to remove dried SOG, and a valve subsystem (20, 120, 320) fluidly coupled to the SOG supply line (60, 160, 360), cleaning-fluid supply line (22, 122, 322), and delivery nozzle (18, 118, 218, 318, 418) for selectively delivering SOG or a cleaning fluid through the interior conduit (419) of the delivery nozzle (18, 118, 218, 318, 418). A cleaning station 466 may be used to clean an exterior (421) of the nozzle (18, 118 218, 318, 418). A method for applying SOG to a substrate (14) through a delivery nozzle (18, 118,218,318,418) and for cleaning the delivery nozzle (18, 118, 218, 318, 418) includes the steps of delivering SOG to the substrate (14) and cleaning the nozzle (18, 118, 218, 318, 418) when cleaning is desirable by among other things delivering a cleaning fluid from a cleaning fluid supply line (22, 122, 322) through the valve subsystem (20, 120, 320) to the interior conduit (419) of the delivery nozzle (18, 118, 218, 318, 418) to remove any SOG from the interior conduit (419).

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"Multilevel-Interconnect Technology for VLSI and ULSI" Chapter 4, pp. 176-236, Silicon Processing for the VLSI Era, vol. II, Process Integra .COPYRGT. 1990, by Stanley Wolf, Ph.D.

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